2"DPSS

Inspection

Item

Detail

Spec

Description

SEM
Image
Inspection

Width

Average

2.70±0.15um

◇Flat-top shaped pattern not allowed

Unif.

≤5%

Height

Average

1.65±0.15um

Unif.

≤5%

Scope Inspection

Particle

＜50um*

≤100ea

◇No visible particle on wafer
◇The total lens should be less than 3mm

[50um，250um]*

≤30ea

[250um,500um]*

≤20ea

[500um,1500um]*

≤10ea

＞1500um*

0

Pattern Missing

＜50um*

≤80ea

◇The total length shoud be less than 2mm

[50um，250um]*

≤30ea

[250um,500um]*

≤15ea

[500um,1500um]*

≤8ea

＞1500um*

0

Pattern Fail

＜50um*

≤80ea

[50um，250um]*

≤30ea

[250um,500um]*

≤15ea

[500um,1500um]*

≤8ea

＞1500um*

0

Scratch

≤1.2mm

≤7ea

◇width≤60um and lenth≤1.2mm should be judged as 1ea
◇if the pattern link happenes in the nearest 20 patternes area from the scratch,the pattern link should not be counted

Edge Bead

Edge Bead

≤1.8mm

◇The pattern failed within the 1.8mm area from the wafer edge should not be counted
◇The non-pattern area should be less than1mm from the wafer edge

Abnormal Shape

Abnormal Shape

≤3%

Total area of abormal shape pattern should be less than 3%